General Informations
The PCB surface (final surface, metallization, finish) has the task of protecting the copper of the connection surfaces from oxidation and making it durable for a sufficient period of time to be able to reliably carry out the intended assembly and connection technology (AVT).
Today, connection techniques go far beyond soldering. In addition to the solderability of the surfaces, other requirements must often be met. The following techniques are used:
| Surface | Soldering | US-Bonding (AI) | TS-Bonding (Au) | Conductive Bonding | Press-Fit Technology | CIF-Connector | Connector Strips | Sliding Contacts | Inching Contacts | Crimping | RoHS-Compliance | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Tin |
Immersion Tin |
+ |
|
|
+ |
+ |
+ |
|
|
|
|
+ |
|
HAL SnCuNi |
+ |
|
|
|
+ |
|
|
|
|
|
+ |
|
|
HAL SnPb |
+ |
|
|
|
+ |
|
|
|
|
|
|
|
|
Immersion Ni/SnPb (Ni/Tin Pad) |
+ |
|
|
|
|
|
|
|
|
|
|
|
|
Gold |
Immersion. Ni/Au (ENIG) |
+ |
+ |
|
+ |
|
+ |
+ |
|
+ |
|
+ |
|
Immersion Ni/Pd/Au (ENEPIG) |
+ |
+ |
+ |
+ |
|
+ |
+ |
|
+ |
|
+ |
|
|
electroless Pd/Au (EPIG) |
+ |
+ |
+ |
+ |
+ |
|
|
|
|
|
+ |
|
|
electroless Ni/Reduktiv-Au |
+ |
+ |
+ |
+ |
+ |
|
|
|
|
|
+ |
|
|
electroplated Ni/Finegold |
|
+ |
+ |
+ |
|
|
|
|
|
|
+ |
|
|
electroplated Ni/Hard Gold |
|
|
|
+ |
|
+ |
+ |
+ |
+ |
|
+ |
|
|
Silver |
Electroless Silver |
+ |
+ |
|
|
+ |
|
|
|
|
|
+ |
|
ISIG (former ASIG) |
+ |
+ |
|
|
+ |
|
|
|
|
|
+ |
|
|
electroplated Silver |
|
|
|
|
+ |
|
+ |
|
|
|
+ |
|
|
Copper |
Bare Copper |
+ |
|
|
|
|
|
|
|
|
+ |
+ |
|
OSP |
+ |
|
|
|
|
|
|
|
|
|
+ |
|
|
Carbon Print |
|
|
|
|
|
|
|
|
+ |
|
+ |
If you have any further questions regarding the surfaces of printed circuit boards, please do not hesitate to contact our technology manager Dr. Lehnberger:
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Unser Technologieleiter, Herr Dr. Lehnberger, wird Ihnen am 10.06. und 12.06. einen Einblick in die Besonderheiten beim Einsatz von Langflex-Leiterplatten geben.
Unser Technologieleiter, Herr Dr. Lehnberger, wird Ihnen am 08.04. und 10.04. einen Einblick in FR4-Material geben.
Unser Technologieleiter, Herr Dr. Lehnberger, wird Ihnen am 19.08. und 21.08. einen Einblick in Hochfrequenz-Leiterplatten und Impedanzkontrolle geben.
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