ANDUS Newsletter

The third issue of our newsletter INFORMANDUS in 2011 is out now!

Main topics:
In this issue we report about Thermal Management.
In view of the technology we report about variations of flex and rigid flex PCBs.

You are welcome to download the current INFORMANDUS issue directly here (German).

In the overview of INFORMANDUS issues you can find further interesting newsletter
since 2005 (German).